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RD-3000 is a versatileeutectic die bondersuitable for adhesiveand eutectic chip packaging processes. ● Automatic nozzle change mechanism. ● Air-floating bonding head mechanism to ensure placement accuracy and consistent bonding pressure. ● Compat
● Supports placement of multiple chip types simultaneously ● Equipped with an auto-zoom motorized lens to accommodate different component sizes ● Programmable operation for various process requirements
PH-550P is a eutectic bonding machineused in COB and COC processes. It bonds the substrate and chip by melting solder according to a controlled temperature profile after CCD-based positioning.The system is primarily composed of a eutectic bonding stage, c
1, PH-100是COC等制程中将耐高温基底与芯片，经过控制温度曲线熔化焊料从而键合在一-起的共晶设备。 2,设备主要由共晶台，贴片吸嘴组件，对位CCD，脉冲加热系统等组成。 3,共晶台包含X、Y、T三轴系统组成，上面设置共晶加热模块，冷氮气环境保护系统，共晶台冷却系统。 4,贴片吸嘴组件设在Z轴上……