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High-Precision Eutectic Die Bonder
RD-800
RD-800 is a fully automatic multifunctional die bonder designed for high-precision multi-chip placement in packaging processes.
Product Details
Machine Overview:
RD-800 is a fully automatic multifunctional die bonder designed for high-precision multi-chip placement in packaging processes.
RD-800 is a production machine used in COB/COC processes to perform die bonding by attaching chips onto substrates (such as PCBs or other workpieces) through dispensing process. It features a dual-drive linear motor gantry structure, high-precision camera recognition for positioning, and automatic nozzle change for the dispensing head. The system supports automated substrate loading and unloading in a conveyor-line configuration.
Loading:
The operator manually installs the required nozzles and sets up the program, then place the substrate fixtures into the automatic loading/unloading cassette (both sides of the machine can interface with automated loading/unloading equipment), and manually place multiple chip trays.
Automated Workflow:
Press the automatic production button. The substrate carrier automatically enters from the left side of the conveyor line and stops at the middle position blocked by a stopper. The lift table rises to position the substrate carrier.
The robotic arm moves: first, the CCD mounted on the arm identifies the position and shape of the chips. The nozzle picks up the chips and places them onto the lower chip calibration stage. The CCD on the arm re-identifies the chips, and the calibration stage adjusts the chip coordinates and angles. The nozzle then picks up the chips again. The robotic arm moves above the product substrate, the CCD identifies the specific placement position, and the nozzle places the chips accurately on the substrate.
The dispensing operation follows a similar principle to chip placement: the CCD first identifies the substrate coordinates, and the dispensing head automatically completes the dispensing.
The robotic arm automatically swaps nozzles to accommodate different chip sizes or replaces the nozzle with a dispensing head as required.
Machine Specifications:
Dimensions (mm): Y 1260 × X 1580 × Z 1960
Weight: 1500 kg
Voltage: 220 V
Axis repeatability: ±1 µm
Placement accuracy: ±5 µm
Wafer size: 8" (tray 2"×2", 9 pcs)
Chip size: 0.2–3 mm
Substrate size: 50×150 mm – 150×300 mm
Air pressure: 0.4–0.6 MPa
Angular resolution: ±0.5°
Die Bonding Pressure: 20–300 g
Nozzle stock quantity: 6