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RD-3000 is a versatileeutectic die bondersuitable for adhesiveand eutectic chip packaging processes. ● Automatic nozzle change mechanism. ● Air-floating bonding head mechanism to ensure placement accuracy and consistent bonding pressure. ● Compat
● Supports placement of multiple chip types simultaneously ● Equipped with an auto-zoom motorized lens to accommodate different component sizes ● Programmable operation for various process requirements
PH-550P is a eutectic bonding machineused in COB and COC processes. It bonds the substrate and chip by melting solder according to a controlled temperature profile after CCD-based positioning.The system is primarily composed of a eutectic bonding stage, c
DB-560P is a production machinedesigned for COB/COC processes, bonding substrates (PCBs or other materials) to chips using an automated dispensing process. Manual Loading: Place the substrate tray into the feed cassette, then install the cassette on
This machineis an automated production system designed to bond TO sockets to chips through a dispensing process after rotating the TO sockets to a specified angle (Ɵ) during the manufacturing process. Manual Loading: Place the TO socket strips into
RTO-400 is an automatic lead-forming and component transfer machinedesigned for handling and feeding TO56, TO46, and TO38 components. It features lead forming, component transfer, lead collection, and flipping capabilities.
RD-800 is a fully automatic multifunctional die bonder designed for high-precision multi-chip placement in packaging processes.
ET-503 25G Base Assembly DieBonder is designed for the eutectic assembly of 25G TO56 and TO60 bases with large heat sinks. This automated production system bonds multiple solder preforms between the 25G large heat sink and the TO56 or TO60 base through co
The ET-501P is a dedicated production machinedesigned to eutectically bond the submount and chip(LD) onto a TO56 header through a controlled heating process.
The substrate is manually placed into the substrate fixture, which is then loaded into the automatic loading/unloading magazine. Chip trays or blue tapes are also manually loaded.
● Utilizes an ultrasonic welding process optimized for pins – torque welding process. ● Full-process monitoring of pressure, energy, and time ensures welding quality. ● Automatic loading/unloading, automatic alignment, and automatic welding. ● In